TSMC is urgently seeking equipment suppliers from whom it can buy CoWoS (Chip on Wafer on Substrate) machines, as Nvidia, AMD, and Amazon expand orders for AI chips, local media outlet Economic Daily News exclusively reported on Monday. TSMC has increased its equipment orders for CoWoS by 30% to meet growing AI-fueled demand…
阅读更多（Read More）
TSMC’s advanced packaging capacity under strain as Nvidia, AMD, and Amazon increase orders for AI chips: report
作者gocpmall
10 月 1, 2023