Nvidia’s use of TSMC’s Chip-on-Wafer-on-Substrate (CoWoS) packaging for its new Blackwell platform products has led to the Taiwanese manufacturer ramping up its production capacity for 2024. Nvidia’s latest Blackwell platform products include the new B200 GPU (Graphics Processing Unit) and the GB200, which integrates the Grace CPU (Central Processing Unit…
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Strong demand for Nvidia’s Blackwell drives 150% increase in TSMC’s CoWoS capacity this year
作者gocpmall
4 月 19, 2024